Method for manufacturing lens for electronic spectacles, lens for electronic spectacles, and electronic spectacles

ABSTRACT

A first recess ( 102 ) of a lower substrate ( 100 ) is coated with conductive ink to form a first auxiliary electrode layer ( 104 ), a lower electrode pattern ( 105 ) is formed thereon by vacuum deposition, a second recess ( 202 ) of an upper substrate ( 200 ) is coated with the conductive ink to form a second auxiliary electrode layer ( 204 ), an upper electrode pattern ( 205 ) is formed thereon by vacuum deposition, the upper and lower substrates are bonded to each other with an electric element ( 300 ) interposed between the lower substrate ( 100 ) and the upper substrate ( 100 ), and the upper and lower substrates are cut at positions on the overlap portion of the first auxiliary electrode layer ( 104 ) and the lower electrode pattern ( 105 ) and the overlap portion of the second auxiliary electrode layer ( 204 ) and the upper electrode pattern ( 205 ) so as to expose the cut surfaces of the substrates.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Continuation of application Ser. No. 12/809,790,filed Jun. 21, 2010, which is a U.S. National Stage application ofPCT/JP2008/003799 filed Dec. 17, 2008, which applications areincorporated herein by reference.

TECHNICAL FIELD

The present invention relates to electric wiring for an electric elementof a lens part in electronic spectacles and proposes a structure capableof particularly improving the reliability of electric connection.

BACKGROUND ART

Electronic spectacles have been proposed in which electric elements suchas an electrochromic (EC) element and a liquid crystal element areformed on or in a lens and the function of the lens is changed bysupplying electric energy to the electric elements.

For example, electronic spectacles using EC elements are available.

In this example, an electrode wiring method for driving an EC element isshown in FIG. 43 that is a sectional view of a lens. As shown in FIG.43, an EC element 607 formed on a substrate lens 601 is made up of alower ITO transparent electrode 602, an Ir₂O₃/SnO₂ layer 603, a Ta₂O₅layer 604, a WO₃ layer 605, and an upper ITO transparent electrode layer606. Further, plated layers 608 a and 608 b of two-layer structures areformed on the outer periphery of the lens (the inclined surfaces ofV-blocks) as electrodes for extraction from the electrode layers. Theplated layers 608 a and 608 b are in electrical contact with the upperITO transparent electrode layer 606 and the lower ITO transparentelectrode layer 602, respectively. As shown in FIG. 44, the frame of thespectacles is made up of metallic upper and lower rims 609 a and 609 bsharing a current path. The upper and lower rims 609 a and 609 b arejoined via an insulator such as a thin plastic sheet.

A method for joining the lens and the rims and connecting a control unitand the EC element 607 is disclosed in which the electrodes 608 a and608 b formed on the outer periphery of the lens and the upper and lowerrims 609 a and 609 b are brought into contact with each other andterminals from the control unit are fastened between rim locks 609 a 1on the ends of the upper and lower rims 609 a and 609 b (e.g., seepatent document 1).

-   Patent document 1: Japanese Utility Model Laid-Open No. 2-138720

DISCLOSURE OF THE INVENTION Problem to be Solved by the Invention

In the configuration of the prior art, however, the lower ITOtransparent electrode 602 and the upper ITO transparent electrode layer606, which are electrodes provided on the outer periphery of the lens,are electrically connected only through contact with the upper rim 609 aand the lower rim 609 b that act as rims. Thus the electrical connectionmay become faulty when, for example, a screw (not shown) for fasteningthe rim locks 609 a 1 becomes loose.

In order to prevent the faulty electrical connection, it is necessary toincrease the thickness of the ITO transparent electrode layer but a dryprocess such as vacuum deposition cannot increase the thickness of theITO transparent electrode layer. For this reason, the ITO transparentelectrode layer is formed by using a wet process. In the wet process,however, ITO particles dispersed into an ink solvent increase theelectrical resistance of the ITO transparent electrode layer, therebydegrading the operating characteristics of the element in the lens.

The present invention has been devised to solve the problem of the priorart. An object of the present invention is to provide electronicspectacles that can increase the reliability of electrical connection toan electronic circuit outside a lens without degrading the operatingcharacteristics of an element in the lens of the electronic spectacles.Another object of the present invention is to provide a method forefficiently manufacturing the lens for electronic spectacles.

Means for Solving the Problem

A method for manufacturing a lens for electronic spectacles according tothe present invention, in the fabrication of the lens containing anelectric element between a lower substrate and an upper substrate, themethod including: fabricating the lower substrate such that a firstrecess for lens electrode pads is formed on a surface of the lowersubstrate, the surface being opposed to the upper substrate, the firstrecess is coated with conductive ink to form a transparent firstauxiliary electrode layer, and a transparent lower electrode pattern isformed on the electric element forming part of the lower substrate andthe first auxiliary electrode layer by a vacuum deposition method so asto connect the electric element forming part and the first auxiliaryelectrode layer; fabricating the upper substrate such that a secondrecess for the lens electrode pads is formed on a surface of the uppersubstrate, the surface being opposed to the lower substrate, the secondrecess is coated with conductive ink to form a transparent secondauxiliary electrode layer, and a transparent upper electrode pattern isformed by the vacuum deposition method on a part corresponding to theelectric element forming part on the upper substrate and the secondauxiliary electrode layer so as to connect the part corresponding to theelectric element forming part and the second auxiliary electrode layer;and joining the upper and lower substrates with the electric elementinterposed between the electric element forming part of the lowersubstrate and the upper substrate.

A method for manufacturing a lens for electronic spectacles according tothe present invention, in the fabrication of the lens containing anelectric element between a lower substrate and an upper substrate, themethod including: fabricating the lower substrate such that a firstrecess for lens electrode pads is formed on a surface of the lowersubstrate, the surface being opposed to the upper substrate, a lowerelectrode pattern is formed on the electric element forming part of thelower substrate and the first recess so as to connect the electricelement forming part and the first recess, and the lower electrodepattern of the first recess is coated with conductive ink to form atransparent first auxiliary electrode layer; fabricating the uppersubstrate such that a transparent upper electrode pattern is formed by avacuum deposition method on a part corresponding to the electric elementforming part on the upper substrate and a second recess for the lenselectrode pads so as to connect the part corresponding to the electricelement forming part and the second recess, and the upper electrodepattern of the second recess is coated with conductive ink to form atransparent second auxiliary electrode layer; and joining the upper andlower substrates with the electric element interposed between theelectric element forming part of the lower substrate and the uppersubstrate.

The method for manufacturing the lens for electronic spectacles furtherincludes, after joining the upper and lower substrates, cutting theupper and lower substrates at positions on the first and second recessesto expose the cut surfaces of the first and second recesses on a lensend.

The method for manufacturing the lens for electronic spectacles furtherincludes: after joining the upper and lower substrates, cutting theupper and lower substrates at positions on the first and second recessesto expose the cut surfaces of the first and second recesses on a lensend; and forming conductive paste on the exposed first and secondrecesses to form the lens electrode pad serving as an extractionelectrode for the first auxiliary electrode layer and the lowerelectrode pattern and the lens electrode pad serving as an extractionelectrode for the second auxiliary electrode layer and the upperelectrode pattern.

A lens for electronic spectacles according to the present invention is alens containing an electric element between two substrates, wherein alens electrode pad on one end of an electrode for applying a voltage tothe electric element is exposed on a lens end, and the lens electrodepad has the electrode formed in a recess on a bonded surface of one ofthe two substrates, the electrode being formed by stacking an auxiliaryelectrode layer formed of conductive ink and a lower electrode patternformed by a vacuum deposition method.

The recess is exposed on the lens end as a curved surface.

A method for manufacturing a lens for electronic spectacles according tothe present invention, in the fabrication of the lens containing anelectric element between a lower substrate and an upper substrate, themethod including: fabricating the lower substrate such that a surface ofthe lower substrate is coated with conductive ink to form a transparentfirst auxiliary electrode layer for lens electrode pads, the surfacebeing opposed to the upper substrate, and a transparent lower electrodepattern is formed by a vacuum deposition method on the electric elementforming part of the lower substrate and the first auxiliary electrodelayer so as to connect the electric element forming part and the firstauxiliary electrode layer; fabricating the upper substrate such that asurface of the upper substrate is coated with the conductive ink to forma transparent second auxiliary electrode layer for the lens electrodepads, the surface being opposed to the lower substrate, and atransparent upper electrode pattern is formed by the vacuum depositionmethod on a part corresponding to the electric element forming part onthe upper substrate and the second auxiliary electrode layer so as toconnect the part corresponding to the electric element forming part andthe second auxiliary electrode layer; and joining the upper and lowersubstrates with the electric element interposed between the electricelement forming part of the lower substrate and the upper substrate.

A method for manufacturing a lens for electronic spectacles according tothe present invention, in the fabrication of the lens containing anelectric element between a lower substrate and an upper substrate, themethod including: fabricating the lower substrate such that atransparent lower electrode pattern for applying a signal to theelectric element forming part of the lower substrate is formed by avacuum deposition method, and one end of the lower electrode pattern iscoated with conductive ink to form a transparent first auxiliaryelectrode layer; fabricating the upper substrate such that a transparentupper electrode pattern is formed by the vacuum deposition method, theupper electrode pattern applying a signal to a part corresponding to theelectric element forming part on the upper substrate, and one end of theupper electrode pattern is coated with conductive ink to form atransparent second auxiliary electrode layer; and joining the upper andlower substrates with the electric element interposed between theelectric element forming part of the lower substrate and the uppersubstrate.

The method for manufacturing the lens for electronic spectacles furtherincludes, after joining the upper and lower substrates, cutting theupper and lower substrates at positions on the overlap portion of thefirst auxiliary electrode layer and the lower electrode pattern and theoverlap portion of the second auxiliary electrode layer and the upperelectrode pattern to expose the cut surfaces of the substrates.

The method for manufacturing the lens for electronic spectacles furtherincludes: after joining the upper and lower substrates, cutting theupper and lower substrates at positions on the overlap portion of thefirst auxiliary electrode layer and the lower electrode pattern and theoverlap portion of the second auxiliary electrode layer and the upperelectrode pattern to expose the cut surfaces of the substrates; andforming conductive paste on the overlap portion of the first auxiliaryelectrode layer and the lower electrode pattern and the overlap portionof the second auxiliary electrode layer and the upper electrode patternto form the lens electrode pad serving as an extraction electrode forthe first auxiliary electrode layer and the lower electrode pattern andthe lens electrode pad serving as an extraction electrode for the secondauxiliary electrode layer and the upper electrode pattern.

A lens for electronic spectacles according to the present invention is alens containing an electric element between two substrates, wherein anelectrode for applying a voltage to the electric element has one endexposed on a lens end, and the one end of the electrode is formed bystacking an auxiliary electrode layer formed of conductive ink and alower electrode pattern formed by a vacuum deposition method.

A method for manufacturing a lens for electronic spectacles according tothe present invention, in the fabrication of the lens containing anelectric element between a lower substrate and an upper substrate, themethod including: fabricating the lower substrate such that atransparent lower electrode pattern for applying a signal to theelectric element forming part of the lower substrate is formed by avacuum deposition method, a lower insulating layer pattern is formed onthe electric element forming part and the lower electrode pattern of thelower substrate except for a part to be coated with a first auxiliaryelectrode layer, and the hole of the lower insulating layer pattern iscoated with conductive ink to form the transparent first auxiliaryelectrode layer; fabricating the upper substrate such that a transparentupper electrode pattern is formed by the vacuum deposition method, theupper electrode pattern applying a signal to a part corresponding to theelectric element forming part on the upper substrate, an upperinsulating layer pattern is formed on the part corresponding to theelectric element forming part on the upper substrate and on the upperelectrode pattern except for a part to be coated with a second auxiliaryelectrode layer, and the hole of the upper insulating layer pattern iscoated with conductive ink to form the transparent second auxiliaryelectrode layer; and joining the upper and lower substrates with theelectric element interposed between the electric element forming part ofthe lower substrate and the upper substrate.

A method for manufacturing a lens for electronic spectacles according tothe present invention, in the fabrication of the lens containing anelectric element between a lower substrate and an upper substrate, themethod including: fabricating the lower substrate such that a firstrecess for lens electrode pads is formed on a surface of the lowersubstrate, the surface being opposed to the upper substrate, a lowerelectrode pattern is formed on the electric element forming part of thelower substrate and the first recess so as to connect the electricelement forming part and the first recess, a lower insulating layerpattern is formed on the electric element forming part and the lowerelectrode pattern of the lower substrate except for a part to be coatedwith a first auxiliary electrode layer, and the hole of the lowerinsulating layer pattern is coated with conductive ink to form thetransparent first auxiliary electrode layer; fabricating the uppersubstrate such that a transparent upper electrode pattern is formed by avacuum deposition method on a part corresponding to the electric elementforming part on the upper substrate and a second recess for the lenselectrode pads so as to connect the part corresponding to the electricelement forming part and the second recess, an upper insulating layerpattern is formed on the upper electrode pattern and the partcorresponding to the electric element forming part on the uppersubstrate, except for a part to be coated with a second auxiliaryelectrode layer, and the hole of the upper insulating layer pattern iscoated with conductive ink to form the transparent second auxiliaryelectrode layer; and joining the upper and lower substrates with theelectric element interposed between the electric element forming part ofthe lower substrate and the upper substrate.

Further, electronic spectacles of the present invention are electronicspectacles in which a lens containing an electric element is set in aspectacle frame, the lens having lens electrode pads exposed on the lensend, the lens electrode pads being disposed on one end of an electrodefor applying a voltage to the electric element, the spectacle frameincluding an electric connector having one end connected to a controlunit for controlling the electric element, the electric connector havingwiring electrode pads disposed on the other end of the electricconnector so as to correspond to the positions of the lens electrodepads of the lens, the electronic spectacles having anisotropicconductive rubber interposed between the wiring electrode pad of theelectric connector and the lens electrode pad of the lens.

The electronic spectacles further include a rim-side spot facing in therim of the spectacle frame, the electric connector being placed in therim-side spot facing; and a lens-side spot facing on the lens end of thelens, the anisotropic conductive rubber being placed in the lens-sidespot facing.

Further, the electric connector passes through the rim locks of thespectacle frame and is provided in the rim, and the wiring electrodepads are set inside the rim of the spectacle frame.

ADVANTAGE OF THE INVENTION

With this configuration, a lens for electronic spectacles has lenselectrode pads exposed on a lens end and an electrode formed by stackingan auxiliary electrode layer formed of ITO ink and a lower electrodepattern obtained by ITO sputtering. Thus the electrode of an electrodepattern can have a relatively small volume resistivity and a high lighttransmittance can be achieved without making the electrode patternundesirably noticeable.

Further, a spectacle frame has an electric connector on which wiringelectric pads are disposed at positions corresponding to the lenselectrode pads of the lens, and anisotropic conductive rubber isinterposed between the wiring electrode pads and the lens electrodepads. Thus it is possible to prevent disconnection caused by theloosening of a lens fastening part or a displacement of electric wiringand prevent electrical problems such as a short circuit caused by anelectric leak.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an enlarged view of the principle part of electronicspectacles according to a first embodiment of the present invention;

FIG. 2 is an enlarged view of the principle part of the electronicspectacles according to the first embodiment;

FIG. 3 is an enlarged view showing the principle part of electronicspectacles in which spot facings are formed according to a secondembodiment of the present invention;

FIG. 4 is an enlarged view showing the principle part of the electronicspectacles in which spot facings are formed according to the secondembodiment;

FIG. 5 shows a top view of the electronic spectacles and an enlargedview from a user;

FIG. 6 is an exploded image of a completed lens 1 according to a thirdembodiment of the present invention;

FIG. 7 is a perspective view showing a process of fabricating a lowersubstrate according to the third embodiment;

FIG. 8 is a sectional view showing the process of fabricating the lowersubstrate according to the third embodiment;

FIG. 9 is a perspective view showing a process of fabricating an uppersubstrate according to the third embodiment;

FIG. 10 is a sectional view showing the process of fabricating the uppersubstrate according to the third embodiment;

FIG. 11 is an enlarged perspective view in which a lens of the thirdembodiment is cut at a position on a first auxiliary electrode layer104;

FIG. 12 is a sectional view in which the lens of the third embodiment iscut at the position on the first auxiliary electrode layer 104;

FIG. 13 is an enlarged perspective view in which the lens of the thirdembodiment is cut at a position on a second auxiliary electrode layer204;

FIG. 14 is a sectional view in which the lens of the third embodiment iscut at the position on the second auxiliary electrode layer 204;

FIG. 15 is a plan view showing the cutting position of the lensaccording to the third embodiment;

FIG. 16 is an enlarged perspective view showing a lens end face of thecut lens according to the third embodiment;

FIG. 17 is an enlarged view showing the principle part of the thirdembodiment;

FIG. 18 shows a schematic view of a spectacle frame and an enlargedperspective view and a structural diagram of a lug of the spectacleframe according to the third embodiment;

FIG. 19 is a structural diagram showing that the lens is set in thespectacle frame according to the third embodiment;

FIG. 20 is an enlarged perspective view of another example in whichsilver paste is applied to a lens end face of the lens according to thethird embodiment;

FIG. 21 is a structural diagram showing another example in which thelens is set in the spectacle frame according to the third embodiment;

FIG. 22 is an exploded image of a completed lens 1 according to a fourthembodiment of the present invention;

FIG. 23 is a sectional view showing a process of fabricating a lowersubstrate according to the fourth embodiment;

FIG. 24 is an enlarged perspective view in which a lens of the fourthembodiment is cut at a position on a first auxiliary electrode layer104;

FIG. 25 is a sectional view in which the lens of the fourth embodimentis cut at a position on a second auxiliary electrode layer 204;

FIG. 26 is an exploded image of a completed lens 1 according to a fifthembodiment of the present invention;

FIG. 27 is a perspective view showing a process of fabricating a lowersubstrate according to the fifth embodiment;

FIG. 28 is a sectional view showing the process of fabricating the lowersubstrate according to the fifth embodiment;

FIG. 29 is a perspective view showing a process of fabricating an uppersubstrate according to the fifth embodiment;

FIG. 30 is a sectional view showing the process of fabricating the uppersubstrate according to the fifth embodiment;

FIG. 31 is an enlarged perspective view in which a lens of the fifthembodiment is cut at a position on a first recess 102;

FIG. 32 is a sectional view in which the lens of the fifth embodiment iscut at the position on the first recess 102;

FIG. 33 is an enlarged perspective view in which the lens of the fifthembodiment is cut at a position on a second recess 202;

FIG. 34 is a sectional view in which the lens of the fifth embodiment iscut at the position on the second recess 202;

FIG. 35 is a plan view showing the cutting position of the lensaccording to the fifth embodiment;

FIG. 36 is an enlarged perspective view showing a lens end face of thecut lens according to the fifth embodiment;

FIG. 37 is an exploded image of a completed lens 1 according to a sixthembodiment of the present invention;

FIG. 38 is a sectional view showing a process of fabricating a lowersubstrate according to the sixth embodiment;

FIG. 39 is an enlarged perspective view in which a lens of the sixthembodiment is cut at a position on a first recess 102;

FIG. 40 is a sectional view in which the lens of the sixth embodiment iscut at a position on a second recess 202;

FIG. 41 is an exploded image of a completed lens 1 according to aseventh embodiment of the present invention;

FIG. 42 is an exploded image of a completed lens 1 according to aneighth embodiment of the present invention;

FIG. 43 shows electronic spectacles of the prior art; and

FIG. 44 shows the electronic spectacles of the prior art.

BEST MODE FOR CARRYING OUT THE INVENTION

The following will specifically describe embodiments of electronicspectacles of the present invention in accordance with the accompanyingdrawings.

First Embodiment

FIGS. 5( a) and 5(b) show electronic spectacles.

FIG. 1 is a sectional view taken along line A-A of FIG. 5( a) and asectional view of the joints of lens electrode pads and wiring electrodepads according to a first embodiment of the present invention.

FIG. 2 is a sectional view taken along line B-B of FIG. 5( b) and animage of the joint of the lens electrode pad and the wiring electrodepad.

The electronic spectacles of the present invention include a spectacleframe 11; a lens 1 that has an electric element (not shown) such as aliquid crystal and an electrochromic element and is set in a rim 8 ofthe spectacle frame 11; a control unit 5 that is provided beside thespectacle frame 11 and generates an electric signal for driving theelectric element of the lens 1; an electric connector 4 that is providedbeside the spectacle frame 11 and transmits a signal from the controlunit 5; anisotropic conductive rubber 7 sandwiched between the lens 1and the rim 8; and a screw 10 for fastening upper and lower rim locks 9of the rim 8.

The lens 1 is fit into a groove 8 a formed inside the rim 8. The lens 1has electrode patterns 2 a and 2 b for transmitting the electric signalto the electric element and lens electrode pads 3 a and 3 b that areformed on a V-block 1 a to increase the contact areas of the electrodepatterns 2 a and 2 b on the ends of the electrode patterns 2 a and 2 b.

On one end of the electric connector 4 beside the spectacle frame 11,electrode pads 6 a and 6 b are formed so as to be electrically connectedto the lens electrode pads 3 a and 3 b via the anisotropic conductiverubber 7.

The electrode patterns 2 a and 2 b are formed of extremely thintransparent electrodes such as ITO electrodes and are exposed to theoutside on the V-block 1 a provided on the outer sidewall of the lens 1.The electrode patterns 2 a and 2 b are only about 10 nm to 40 nm inthickness and are exposed to the outside as extremely thin lines ofabout 10 nm to 40 nm. Thus the electrode patterns 2 a and 2 b may be inpoor electric contact with the anisotropic conductive rubber 7. For thisreason, in the first embodiment, silver paste and nanoparticles are usedfor the electrode patterns 2 a and 2 b exposed to the outside of thelens 1 and the lens electrode pads 3 a and 3 b are formed on a plane ofthe V-block 1 a to expand an electrode part.

In this case, the electrode patterns 2 a and 2 b are spaced only severalμm apart in the thickness direction of the lens, the spacing beingsubstantially equal to the thickness of the electric element. In orderto form the lens electrode pads 3 a and 3 b respectively on theelectrode patterns 2 a and 2 b, it is necessary to prevent the electrodepatterns 2 a and 2 b on the end of the lens from overlapping each otherin the thickness direction of the lens.

The electric signal generated from the control unit 5 made up of a powersupply and an IC (integrated circuit) is transmitted to the wiringelectrode pads 6 a and 6 b, which are shaped like the lens electrodepads 3 a and 3 b, through the electric connector 4 such as a flexiblesubstrate, and then the electric signal is transmitted to the lenselectrode pads 3 a and 3 b through the anisotropic conductive rubber 7.

The anisotropic conductive rubber 7 provided between the lens electrodepads 3 a and 3 b and the wiring electrode pads 6 a and 6 b is typicalanisotropic conductive rubber that has a side wall surface coated with arubber material such as silicone. The shape of the anisotropicconductive rubber 7 is set such that the anisotropic conductive rubber 7serving as an elastic body is sufficiently compressed (deformed) incontact with the exposed surface of a conducting part when the rim locks9 are fastened by the screw 10 to attach the lens.

Thus even when the screw 10 fastening the rim locks 9 becomes somewhatloose, the electronic spectacles configured thus can be used withoutelectrical disconnection because the anisotropic conductive rubber 7 iselastically deformed.

Further, the lens electrode pads 3 a and 3 b and the wiring electrodepads 6 a and 6 b can be sealed by the compressive deformation of theanisotropic conductive rubber 7, so that the electronic spectacles canbe used even in the rain without causing short circuits.

Second Embodiment

As shown in FIG. 2, an inverted-V protrusion called the V-block 1 a isformed on the outer periphery of the lens 1 and the V-groove 8 a isformed on the inner periphery of the rim 8 provided beside the spectacleframe 11.

In the most typical method, the lens 1 is attached to the spectacleframe by fixing the V-block 1 a and the groove 8 a in engagement witheach other. In this configuration, however, the screw 10 fastening therim locks 9 applies a force diagonally to the anisotropic conductiverubber 7 and the electric connector 4, so that the anisotropicconductive rubber 7 and the electric connector 4 may be displaced fromthe predetermined positions and result in poor assembly (fitting of thelens) and electrical connection.

A second embodiment configured as shown in FIGS. 3 and 4 has improved inthat a force is not diagonally applied to an anisotropic conductiverubber 7 and an electric connector 4 during assembly.

FIG. 3 is an image of a sectional view showing the joints of the lenselectrode pads and wiring electrode pads of electronic spectacles andFIG. 3 is equivalent to a sectional view taken along line A-A of FIG. 5(a) in which the electronic spectacles are viewed from the top. FIG. 4 isan image showing the joints of the lens electrode pads and the wiringelectrode pads of the electronic spectacles and FIG. 4 is equivalent toa sectional view taken along line B-B of FIG. 5( b) in which theelectronic spectacles are viewed from the front.

As shown in FIGS. 3 and 4, a lens-side spot facing 1 b for theanisotropic conductive rubber 7 is formed around lens electrode pads 3 aand 3 b on a lens 1. Further, on a spectacle frame 11, a rim-side spotfacing 8 b is formed on a part where an electric connector 4 is setinside a rim 8.

The anisotropic conductive rubber 7 and the electric connector 4 are setthus in the spot facings 1 b and 8 b, respectively. Thus even a screw 10fastening rim locks 9 hardly displaces the anisotropic conductive rubber7 and the electric connector 4, so that it is possible to stablyassemble the electronic spectacles and prevent disconnection caused by adisplacement of electric wiring.

To be specific, the lens-side spot facing 1 b and the rim-side spotfacing 8 b are formed such that a load is applied perpendicularly to thebottoms of the lens-side spot facing 1 b and the rim-side spot facing 8b when the rim locks 9 are fastened by the screw 10. This configurationmakes it possible to stably assembly the electronic spectacles andprevent disconnection caused by a displacement of the electric wiring.

In the foregoing embodiments, one end of the electric connector 4 may beconnected to the control unit 5 and the wiring electrode pads 6 a and 6b on the other end of the electric connector 4 may be set in the groove8 a of the rim 8 so as to be opposed to the lens electrode pads 3 a and3 b. For example, the electric connector 4 can be set around the rimlocks 9 and the rim 8.

In this example, as shown in FIGS. 1, 2, 3, and 4, the electricconnector 4 is passed between the rim locks 9 and is placed in thegroove 8 a or the spot facing 8 b inside the rim 8 to further stabilizethe electric connection. Since the electric connector 4 is set betweenthe rim locks, it is possible to prevent a displacement of the electricconnector 4 during assembly and make the electric connector 4undetachable.

To be specific, the electric connector 4 may be fixed between the rimlocks 9 or grooves for the electric connector 4 may be formed on the rimlocks 9. Moreover, a positioning pin for the electric connector 4 may beprovided in the rim locks 9 or the screw 10 may be used as a positioningpin. When grooves are formed, the groove patterns of the formed groovesmay be used as positioning patterns, thereby preventing the electricconnector 4 from being displaced or detached.

The electric connector 4 set between the rim locks 9 can achieveadditional effect on appearance because the electric connector 4 is notexposed to the outside and does not interfere with the design of thespectacles.

In the present embodiment, the position of the control unit 5 is notlimited as long as the control unit 5 is fixed inside a templeconstituting the spectacles or at a lug on the spectacles. By settingthe control unit 5 near the rim locks, the electric connector 4 can beshortened in length.

Third Embodiment

FIGS. 6 to 19 show a method for manufacturing a lens 1 for electronicspectacles.

FIG. 6 shows an exploded image of the completed lens 1 for betterunderstanding of the manufacturing process. The lens 1 contains a liquidcrystal 300 serving as an electric element between a lower substrate 100and an upper substrate 200. Reference numeral 400 denotes an adhesivelayer for joining the lower substrate 100 and the upper substrate 200.

FIGS. 7 and 8 show a process for fabricating the lower substrate 100.

In FIG. 7( a), an electric element forming part 103 is formed on asurface 101 of the lower substrate 100 as shown in FIG. 8( a). Thesurface 101 is opposed to the upper substrate 200 and the liquid crystal300 is placed later on the electric element forming part 103.

In FIG. 7( b), the lower substrate 100 having a smooth surface ispartially coated with conductive ink to form a first auxiliary electrodelayer 104 as shown in FIG. 8( b). To be specific, ITO ink that isconductive ink is used. Regarding the physical property of the ITO ink,the ITO ink containing dispersed conductive particles has a large volumeresistivity of about 2.4×10⁰Ω·cm as compared with a conductive filmformed by ITO sputtering with a volume resistivity of about 6 to2×10⁻⁴Ω·cm, whereas an ITO ink film formed with a thickness of 1 μm hasa spectral transmittance substantially equal to the spectraltransmittance of an ITO conductive film formed by sputtering with athickness of 30 nm. Therefore, the conductive film of the ITO ink ismore transparent than the ITO conductive film formed by sputtering, onthe assumption that films are equal in thickness. The ITO ink can obtaina transmittance of about 80% even when the film is 1 μm in thickness.The ITO ink may be applied by an ink-jet method or a dispenser. Further,the ITO ink can be applied also by spin coating or dipping at anecessary point on the lower substrate 100 masked with tape and thelike. The first auxiliary electrode layer 104 formed of the ITO ink ispreferably at least 1 μm in thickness.

In FIG. 7( c), a lower electrode pattern 105 is formed on the electricelement forming part 103 and the first auxiliary electrode layer 104 soas to connect the electric element forming part 103 and the firstauxiliary electrode layer 104 as shown in FIG. 8( c). To be specific,ITO sputtering is performed using a mask pattern connecting the electricelement forming part 103 and the first auxiliary electrode layer 104.The lower electrode pattern 105 is about 10 nm to 40 nm in thickness.

In FIG. 7( d), a lower insulating layer pattern 106 is formed on theelectric element forming part 103 and the lower electrode pattern 105 asshown in FIG. 8( d). To be specific, after ITO sputtering in FIG. 7( c),SiO₂ is continuously sputtered without removing the lower substrate 100from a chamber (without exposing the lower substrate 100 to theatmosphere). Such sputtering can be performed by a sputtering apparatushaving multiple targets in a single chamber and thus a special apparatusis not necessary.

In FIG. 7( e), an alignment layer 107 is applied to a part to be coatedwith the liquid crystal 300, and rubbing is performed thereon.

FIGS. 9 and 10 show a process for fabricating the upper substrate 200.

The upper substrate 200 having a smooth surface as shown in FIG. 9( a)is coated with conductive ink as shown in FIG. 10( b), so that a secondauxiliary electrode layer 204 is formed as shown in FIG. 9( b). Theconductive ink may be applied by an ink-jet method or a dispenser.Further, the conductive ink can be applied by spin coating or dipping ata necessary point on the upper substrate 200 masked with tape and thelike. The second auxiliary electrode layer 204 is preferably at least 1μm in thickness.

In FIG. 9( c), an upper electrode pattern 205 is formed on a part 203and the second auxiliary electrode layer 204 so as to connect the part203 and the second auxiliary electrode layer 204 as shown in FIG. 10(c). The part 203 corresponds to the electric element forming part 103 onthe lower substrate 100. To be specific, ITO sputtering is performedusing a mask pattern connecting the part 203 and the second auxiliaryelectrode layer 204. The upper electrode pattern 205 is about 10 nm to40 nm in thickness.

In FIG. 9( d), an upper insulating layer pattern 206 is formed on theupper electrode pattern 205 as shown in FIG. 10( d). To be specific,after ITO sputtering in FIG. 9( c), SiO₂ is continuously sputteredwithout removing the upper substrate 200 from a chamber device (withoutexposing the upper substrate 200 to the atmosphere). Such sputtering canbe performed by a sputtering apparatus having multiple targets in asingle chamber and thus a special apparatus is not necessary.

In FIG. 9( e), an alignment layer 207 is applied onto the upperelectrode pattern 205 so as to correspond to the part 203 and rubbing isperformed thereon. The lower substrate 100 and the upper substrate 200are bonded with an adhesive layer 400 in a state in which the liquidcrystal 300 serving as the electric element is interposed between theelectric element forming part 103 of the lower substrate 100 fabricatedthus and the upper substrate 200. To be specific, the liquid crystal 300is applied by a dispenser or the ink-jet method. After the liquidcrystal 300 is applied, an adhesive (sealing agent) is applied aroundthe liquid crystal 300 and then the lower substrate 100 and the uppersubstrate 200 are bonded with the adhesive layer 400.

FIG. 11 is an enlarged perspective view in which the bonded lowersubstrate 100 and upper substrate 200 are cut at a position on the firstauxiliary electrode layer 104. FIG. 12 is an enlarged view of theprinciple part of FIG. 11. FIG. 13 is an enlarged perspective view inwhich the bonded lower substrate 100 and upper substrate 200 are cut ata position on the second auxiliary electrode layer 204. FIG. 14 is anenlarged view of the principle part of FIG. 13.

As shown in FIG. 15, the lower substrate 100 and the upper substrate 200that have been bonded thus are cut along a cutting line 301 according tothe shape of the rim of the spectacle frame 11. The cutting line 301passes through the end of the first auxiliary electrode layer 104 andthe end of the second auxiliary electrode layer 204. Since thesubstrates are cut thus, as shown in FIG. 16, the end face of theoverlap portion of the first auxiliary electrode layer 104 and the lowerelectrode pattern 105 and the end face of the overlap portion of thesecond auxiliary electrode layer 204 and the upper electrode pattern 205are exposed on a lens end 302. As shown in FIG. 17, the end faces of thefirst auxiliary electrode layer 104 and the lower electrode pattern 105are exposed on the lower substrate 100 and the end faces of the secondauxiliary electrode layer 204 and the upper electrode pattern 205 areexposed on the upper substrate 200.

As shown in FIGS. 18 and 19, the electronic spectacles can beconstructed using the lens of FIG. 16. The lenses 1 are set in thespectacle frame 11.

As shown in FIG. 18( a), flexible wires 305 a and 305 b serving as anelectric connector 4 are provided at a lug 304 of the spectacle frame11. The flexible wires 305 a and 305 b have one ends connected to thecontrol unit 5 and wiring electrode pads 306 a and 306 b are formed onthe other ends of the flexible wires 305 a and 305 b. As shown in FIG.18( b), the wiring electrode pads 306 a and 306 b are set in a rim 307of the spectacle frame 11.

When the lens 1 is set in the rim 307, anisotropic conductive rubber 308is disposed as shown in FIG. 19 between the wiring electrode pads 306 aand 306 b and the first auxiliary electrode layer 104, the lowerelectrode pattern 105, the second auxiliary electrode layer 204, and theupper electrode pattern 205 of the lens 1. In this state, the lens 1 issupported by the rim 307 with a screw 10, so that the wiring electrodepad 306 a is electrically connected to the lower electrode pattern 105of the lens in a reliable manner via the anisotropic conductive rubber308. Further, the wiring electrode pad 306 b is electrically connectedto the upper electrode pattern 205 of the lens in a reliable manner viathe anisotropic conductive rubber 308. This is because the firstauxiliary electrode layer 104 formed on the lower electrode pattern 105increases a contact area with the anisotropic conductive rubber 308 andimproves electrical continuity. The second auxiliary electrode layer 204has the same effect. With this configuration, a voltage for driving theliquid crystal 300 can be applied between the lower electrode pattern105 and the upper electrode pattern 205 of the lens 1 from the controlunit 5.

In the case where the lower electrode pattern 105 is increased inthickness and the first auxiliary electrode layer 104 is not provided orin the case where the upper electrode pattern 205 is increased inthickness and the second auxiliary electrode layer 204 is not provided,as compared with the present embodiment, the resistance of the electrodecan be reduced but light transmittance decreases without the first andsecond auxiliary electrode layers 104 and 204. The light transmittanceis an important factor of the electronic spectacles. Consequently, thelower electrode pattern 105 and the upper electrode pattern 205 can beeasily visible in an undesirably noticeable manner. In contrast to thisconfiguration, in the third embodiment, the lower electrode pattern 105is reduced in thickness and the first auxiliary electrode layer 104 isstacked thereon to increase the overall thickness. Further, the upperelectrode pattern 205 is reduced in thickness and the second auxiliaryelectrode layer 204 is stacked thereon to increase the overallthickness. Thus the electrode can have a relatively low resistance andthe lower electrode pattern 105 and the upper electrode pattern 205 arenot noticeable. For this reason, the laminated structure of the firstand second auxiliary electrode layers 104 and 204 is quite effective.

In the case where the lower substrate 100 and the upper substrate 200are coated with the first and second auxiliary electrode layers 104 and204 and then the lower electrode pattern 105 and the upper electrodepattern 205 are formed thereon, the lower insulating layer pattern 106and the upper insulating layer pattern 206 can be formed, as previouslymentioned, on the lower electrode pattern 105 and the upper electrodepattern 205 by continuous sputtering without removing the lowersubstrate 100 and the upper substrate 200 by opening the chamber to theatmosphere.

To be specific, in the case where the lower electrode pattern 105 andthe upper electrode pattern 205 are formed on the lower substrate 100and the upper substrate 200 and then the first and second auxiliaryelectrode layers 104 and 204 are applied thereon, it is necessary toform the lower insulating layer pattern 106 and the upper insulatinglayer pattern 206 after forming the lower electrode pattern 105 and theupper electrode pattern 205 by sputtering, opening the sputteringapparatus to the atmosphere to remove the lower substrate 100 and theupper substrate 200, and then changing the mask pattern. Thus vacuumdrawing performed twice in the sputtering apparatus results in acomplicated fabrication process.

In the third embodiment, the first and second auxiliary electrode layers104 and 204 are first formed on the lower substrate 100 and the uppersubstrate 200. In this case, the lower electrode pattern 105 and thelower insulating layer pattern 106 can be formed on the lower substrate100 without opening the sputtering apparatus to the atmosphere, and theupper electrode pattern 205 and the upper insulating layer pattern 206can be formed on the upper substrate 200 without opening the sputteringapparatus to the atmosphere, thereby achieving a simple fabricationprocess.

As shown in FIGS. 20 and 21, it is more preferable to apply conductivepaste on the first auxiliary electrode layer 104 and the secondauxiliary electrode layer 204 because the conductive paste increases thecontact area. To be specific, as shown in FIG. 20, silver pastes 303 aand 303 b are respectively applied as conductive pastes to the exposedend face of the overlap portion of the first auxiliary electrode layer104 and the lower electrode pattern 105 and the end face of the overlapportion of the second auxiliary electrode layer 204 and the upperelectrode pattern 205. Ideally, the silver paste 303 a formed on thelens end 302 is electrically connected to the first auxiliary electrodelayer 104 as well as the lower electrode pattern 105. In the presentembodiment, the thin lower electrode pattern 105 is exposed on the lensend 302 and the first auxiliary electrode layer 104 having a largerthickness than the lower electrode pattern 105 is also exposed on thelens end 302. Thus even when the lower electrode pattern 105 isinsufficiently exposed on the lens end 302, the silver paste 303 a canbe electrically connected to the lower electrode pattern 105 in areliable manner via the thick first auxiliary electrode layer 104.

Similarly, it is ideal that the silver paste 303 b formed on the lensend 302 is electrically connected to the second auxiliary electrodelayer 204 as well as the upper electrode pattern 205. In the presentembodiment, the thin upper electrode pattern 205 is exposed on the lensend 302 and the second auxiliary electrode layer 204 having a largerthickness than the upper electrode pattern 205 is also exposed on thelens end 302. Thus even when the upper electrode pattern 205 isinsufficiently exposed on the lens end 302, the silver paste 303 b canbe electrically connected to the upper electrode pattern 205 in areliable manner via the thick second auxiliary electrode layer 204.

Fourth Embodiment

FIGS. 22 to 25 show a fourth embodiment of the present invention.

In the third embodiment, the lower substrate 100 is coated with thefirst auxiliary electrode layer 104 and then the lower electrode pattern105 is formed thereon, and the upper substrate 200 is coated with thesecond auxiliary electrode layer 204 and then the upper electrodepattern 205 is formed thereon. The fourth embodiment is different onlyin that first and second auxiliary electrode layers 104 and 204 areapplied later and other points are similar to those of the thirdembodiment.

FIG. 22 shows an exploded image of a completed lens 1 for betterunderstanding of the manufacturing process.

In FIG. 23( a), a lower electrode pattern 105 is formed from an electricelement forming part 103 of a lower substrate 100 to a part near theouter periphery of the lower substrate 100.

In FIG. 23( b), only one end of the lower electrode pattern 105 iscoated with conductive ink to form the first auxiliary electrode layer104. After that, a lower insulating layer pattern 106 is formed on theelectric element forming part 103 and the first auxiliary electrodelayer 104 from the lower electrode pattern 105. Further, as shown inFIG. 22, an alignment layer 107 is formed on the lower insulating layerpattern 106 so as to correspond to the position of the electric elementforming part 103.

Also in this case, an upper substrate 200 is formed as in FIGS. 23( a)and 23(b). In other words, as shown in FIG. 22, an upper electrodepattern 205 is formed from a part corresponding to the electric elementforming part 103 on the lower substrate 100 to a part near the outerperiphery of the upper substrate 200, and the upper electrode pattern205 is coated with conductive ink only near the outer periphery of theupper substrate 200 to form the second auxiliary electrode layer 204.Moreover, an upper insulating layer pattern 206 is formed on the upperelectrode pattern 205 and an alignment layer 207 is formed thereon.

As shown in FIG. 23( c), the lower substrate 100 on which the firstauxiliary electrode layer 104 is applied later to the lower electrodepattern 105 and the upper substrate 200 on which the second auxiliaryelectrode layer 204 is applied later to the upper electrode pattern 205are bonded to each other with an adhesive layer 400 in a state in whicha liquid crystal 300 is interposed between the lower substrate 100 andthe upper substrate 200. FIG. 24 is an enlarged perspective view inwhich the bonded lower substrate 100 and upper substrate 200 are cut ata position on the first auxiliary electrode layer 104. FIG. 25 is anenlarged sectional view in which the bonded lower substrate 100 andupper substrate 200 are cut at a position on the upper electrode pattern205.

Even in the case where the first and second auxiliary electrode layers104 and 204 are applied later, as in the third embodiment, the end facesof the first auxiliary electrode layer 104 and the lower electrodepattern 105 of the lower substrate 100 are exposed on a lens end 302 ofthe lens 1 and the end faces of the second auxiliary electrode layer 204and the upper electrode pattern 205 of the upper substrate 200 areexposed on the lens end 302 because the lower and upper substrates 100and 200 are cut along a cutting line 301 as shown in FIG. 15. Otherpoints are similar to those of the third embodiment.

The lower insulating pattern 106 and the upper insulating pattern 206may be formed over the substrates. Therefore, the lower insulatingpattern 106 and the upper insulating pattern 206 can be formed bysputtering without using a mask.

Fifth Embodiment

In the third embodiment, the first auxiliary electrode layer 104 isformed on the smooth surface of the lower substrate 100 and the secondauxiliary electrode layer 204 is formed on the smooth surface of theupper substrate 200, whereas in a fifth embodiment, as shown in FIG. 26,a first recess 102 is formed on a surface 101 of a lower substrate 100and a second recess 202 is formed on a surface 201 of an upper substrate200 such that first and second auxiliary electrode layers 104 and 204can be correctly patterned at predetermined positions even when ITO inkhaving high wettability is used.

FIGS. 26 to 36 show a method for manufacturing a lens 1 for electronicspectacles.

FIG. 26 shows an exploded image of the completed lens 1 for betterunderstanding of the manufacturing process. The lens 1 contains a liquidcrystal 300 serving as an electric element between the lower substrate100 and the upper substrate 200. Reference numeral 400 denotes anadhesive layer for joining the lower substrate 100 and the uppersubstrate 200.

FIGS. 27 and 28 show a process for fabricating the lower substrate 100.

In FIG. 27( a), the first recess 102 and an electric element formingpart 103 are formed on the surface 101 of the lower substrate 100 asshown in FIG. 28( a). The surface 101 is opposed to the upper substrate200 and the liquid crystal 400 is placed on the electric element formingpart 103 later. The first recess 102 is formed by transferring a convexformed on a resin molding die of the lower substrate 100. The firstrecess 102 can be formed after molding. The first recess 102 ispreferably about 0.5 mm to 2 mm in width and about 10 mm to 20 mm inlength. Further, the first recess 102 has a depth of about several tensμm to several hundreds μm.

In FIG. 27( b), the first recess 102 is coated with conductive ink toform the first auxiliary electrode layer 104 as shown in FIG. 28( b).The first auxiliary electrode layer 104 is preferably at least 1 μm inthickness. To be specific, the first recess 102 is filled with ITO inkthat is conductive ink. The ITO ink may be applied by an ink-jet methodor a dispenser. The surface of the first recess 102 formed on thesurface 101 of the lower substrate 100 is coated with the ITO ink toform the first auxiliary electrode layer 104. Thus even when ITO inkhaving high wettability is used, it is possible to correctly pattern thefirst auxiliary electrode layer 104 at a predetermined position on thelower substrate 100.

The first auxiliary electrode layer 104 can be formed also by spincoating or dipping in a state in which a part other than the firstrecess 102 is masked with tape and the like.

In FIG. 27( c), a lower electrode pattern 105 is formed on the electricelement forming part 103 and the first auxiliary electrode layer 104.The lower electrode pattern 105 connects the electric element formingpart 103 and the first auxiliary electrode layer 104 so as to cover thefirst auxiliary electrode layer 104 as shown in FIG. 28( c). To bespecific, ITO sputtering is performed using a mask pattern connectingthe electric element forming part 103 and the first recess 102. Thelower electrode pattern 105 is about 10 nm to 40 nm in thickness.

In FIG. 27( d), a lower insulating layer pattern 106 is formed on theelectric element forming part 103 and the lower electrode pattern 105 asshown in FIG. 28( d). To be specific, after ITO sputtering in FIG. 27(c), SiO₂ is continuously sputtered without removing the lower substrate100 from a chamber (without exposing the lower substrate 100 to theatmosphere). Such sputtering can be performed by a sputtering apparatushaving multiple targets in a single chamber and thus a special apparatusis not necessary.

In FIG. 27( e), an alignment layer 107 is applied to a part to be coatedwith the liquid crystal 300, and rubbing is performed thereon.

FIGS. 29 and 30 show a process for fabricating the upper substrate 200.

In FIG. 29( a), the second recess 202 is formed on the surface 201 ofthe upper substrate 200 as shown in FIG. 30( a). The surface 201 isopposed to the lower substrate 100. The second recess 202 is formed bytransferring a convex formed on a resin molding die of the uppersubstrate 200. The second recess 202 can be formed after molding. Thesecond recess 202 is preferably about 0.5 mm to 2 mm in width and about10 mm to 20 mm in length. Further, the second recess 202 has a depth ofabout several tens μm to several hundreds μm.

In FIG. 29( b), the second recess 202 is coated with conductive ink toform the second auxiliary electrode layer 204 as shown in FIG. 30( b).The second auxiliary electrode layer 204 is preferably at least 1 μm inthickness. To be specific, the second recess 202 is filled with ITO inkthat is conductive ink. The ITO ink may be applied by the ink-jet methodor a dispenser. The surface of the second recess 202 formed on thesurface 201 of the upper substrate 200 is coated with the ITO ink toform the second auxiliary electrode layer 204. Thus even when ITO inkhaving high wettability is used, it is possible to correctly pattern thesecond auxiliary electrode layer 204 at a predetermined position on theupper substrate 200.

The second auxiliary electrode layer 204 can be formed also by spincoating or dipping in a state in which a part other than the secondrecess 202 is masked with tape and the like.

In FIG. 29( c), an upper electrode pattern 205 is formed on a part 203corresponding to the electric element forming part 103 on the lowersubstrate 100 and the second auxiliary electrode layer 204 as shown inFIG. 30( c). The upper electrode pattern 205 connects the part 203 andthe second auxiliary electrode layer 204 so as to cover the secondauxiliary electrode layer 204. To be specific, ITO sputtering isperformed using a mask pattern connecting the part 203 and the secondrecess 202. The upper electrode pattern 205 is about 10 nm to 40 nm inthickness.

In FIG. 29( d), an upper insulating layer pattern 206 is formed on theupper electrode pattern 205 as shown in FIG. 30( d). To be specific,after ITO sputtering in FIG. 29( c), SiO₂ is continuously sputteredwithout removing the upper substrate 200 from a chamber device (withoutexposing the upper substrate 200 to the atmosphere). Such sputtering canbe performed by a sputtering apparatus having multiple targets in asingle chamber and thus a special apparatus is not necessary.

In FIG. 29( e), an alignment layer 207 is applied to a part of the upperelectrode pattern 205 so as to correspond to the part 203, and rubbingis performed thereon.

The lower substrate 100 and the upper substrate 200 are bonded with theadhesive layer 400 in a state in which the liquid crystal 300 serving asthe electric element is interposed between the electric element formingpart 103 of the lower substrate 100 fabricated thus and the uppersubstrate 200. To be specific, the liquid crystal 300 is applied by adispenser or the ink-jet method. After the liquid crystal 300 isapplied, an adhesive (sealing agent) is applied around the liquidcrystal 300 and then the lower substrate 100 and the upper substrate 200are bonded with the adhesive layer 400.

FIG. 31 is an enlarged perspective view in which the bonded lowersubstrate 100 and upper substrate 200 are cut at a position on the firstrecess 102. FIG. 32 is an enlarged view of the principle part of FIG.31. FIG. 33 is an enlarged perspective view in which the bonded lowersubstrate 100 and upper substrate 200 are cut at a position on thesecond recess 202. FIG. 34 is an enlarged view of the principle part ofFIG. 33.

As in FIG. 15, the lower substrate 100 and the upper substrate 200 thathave been bonded thus are cut along a cutting line 301 according to theshape of a rim 8 of a spectacle frame 11. In this case, the substrates100 and 200 are cut at the first and second recesses 102 and 202 and thecut surfaces of the first and second recesses 102 and 202 are exposed ona lens end 302 as shown in FIG. 35. As shown in FIG. 36, on the exposedcut surfaces of the first and second recesses 102 and 202, the end facesof the first auxiliary electrode layer 104 and the lower electrodepattern 105 of the lower substrate 100 are exposed and the end faces ofthe second auxiliary electrode layer 204 and the upper electrode pattern205 of the upper substrate 200 are exposed.

As shown in FIGS. 18 and 19, the electronic spectacles can beconstructed using the lens of FIG. 35. The lenses 1 are set in thespectacle frame 11.

With this configuration, a voltage for driving the liquid crystal 300can be applied between the lower electrode pattern 105 and the upperelectrode pattern 205 of the lens 1 from the control unit 5.

In the case where the first and second recesses 102 and 202 are coatedwith the first and second auxiliary electrode layers 104 and 204 andthen the lower electrode pattern 105 and the upper electrode pattern 205are formed thereon, the lower insulating layer pattern 106 and the upperinsulating layer pattern 206 can be formed, as previously mentioned, onthe lower electrode pattern 105 and the upper electrode pattern 205 bycontinuous sputtering without removing the lower substrate 100 and theupper substrate 200 from the chamber opened to the atmosphere.

To be specific, in the case where the lower electrode pattern 105 andthe upper electrode pattern 205 are formed on the first and secondrecesses 102 and 202 and then the lower electrode pattern 105 and theupper electrode pattern 205 are coated with the first and secondauxiliary electrode layers 104 and 204, the lower electrode pattern 105and the upper electrode pattern 205 are formed on the first and secondrecesses 102 and 202 by sputtering, the sputtering apparatus is openedto the atmosphere to remove the lower substrate 100 and the uppersubstrate 200, the mask pattern is changed, and then the lowerinsulating layer pattern 106 and the upper insulating layer pattern 206are formed. In another method, the lower electrode pattern 105 and theupper electrode pattern 205 are formed on the first and second recesses102 and 202 by sputtering, the sputtering apparatus is opened to theatmosphere to remove the lower substrate 100 and the upper substrate200, the first and second auxiliary electrodes 104 and 204 are formed,and then sputtering is performed again. In both of the methods, however,vacuum drawing performed twice in the sputtering apparatus results in acomplicated fabrication process.

In the present embodiment, the first and second auxiliary electrodelayers 104 and 204 are first applied. In this case, the lower electrodepattern 105 and the lower insulating layer pattern 106 can be formed onthe lower substrate 100 without opening the sputtering apparatus to theatmosphere, and the upper electrode pattern 205 and the upper insulatinglayer pattern 206 can be formed on the upper substrate 200 withoutopening the sputtering apparatus to the atmosphere, thereby achieving asimple fabrication process.

As in FIGS. 20 and 21, it is more preferable to apply silver pastes 303a and 303 b that are conductive pastes onto the first auxiliaryelectrode layer 104 and the second auxiliary electrode layer 204 becausethe silver pastes 303 a and 303 b increase the contact areas. The sameadvantage can be achieved as in the foregoing embodiments.

Sixth Embodiment

In the fourth embodiment, the first auxiliary electrode layer 104 isformed on the smooth surface of the lower substrate 100 and the secondauxiliary electrode layer 204 is formed on the smooth surface of theupper substrate 200, whereas in a sixth embodiment, as shown in FIG. 37,a first recess 102 is formed on a surface 101 of a lower substrate 100and a second recess 202 is formed on a surface 201 of an upper substrate200 such that first and second auxiliary electrode layers 104 and 204can be correctly patterned at predetermined positions even when ITO inkhaving high wettability is used.

FIGS. 37 to 40 show the sixth embodiment of the present invention.

In the fifth embodiment, the first recess 102 is coated with the firstauxiliary electrode layer 104 and then the lower electrode pattern 105is formed thereon, and the second recess 202 is coated with the secondauxiliary electrode layer 204 and then the upper electrode pattern 205is formed thereon. The sixth embodiment is different only in that thefirst and second auxiliary electrode layers 104 and 204 are appliedlater. Other points are similar to those of the fifth embodiment.

FIG. 37 shows an exploded image of a completed lens 1 for betterunderstanding of the manufacturing process.

In FIG. 38( a), a lower electrode pattern 105 is formed from an electricelement forming part 103 to the first recess 102 of the lower substrate100.

In FIG. 38( b), the lower electrode pattern 105 is coated withconductive ink only in the first recess 102 to form the first auxiliaryelectrode layer 104, and a lower insulating layer pattern 106 is formedso as to cover the first auxiliary electrode layer 104, the lowerelectrode pattern 105, and the electric element forming part 103. Asshown in FIG. 37, an alignment layer 107 is formed on the lowerinsulating layer pattern 106 so as to correspond to the position of theelectric element forming part 103.

In this case, the upper substrate 200 is formed as in FIGS. 38( a) and38(b). In other words, as shown in FIG. 37, an upper electrode pattern205 is formed on a part corresponding to the electric element formingpart 103 on the lower substrate 100, the second recess 202, and a partconnecting the electric element forming part 103 and the second recess202. After that, the upper electrode pattern 205 is coated withconductive ink only in the second recess 202 to form the secondauxiliary electrode layer 204. Further, an upper insulating layerpattern 206 is formed so as to cover the second auxiliary electrodelayer 204 and the upper electrode pattern 205. Moreover, an alignmentlayer 207 is formed thereon.

As shown in FIG. 38( c), the lower substrate 100 on which the firstauxiliary electrode layer 104 is applied later onto the lower electrodepattern 105 in the first recess 102 and the upper substrate 200 on whichthe second auxiliary electrode layer 209 is applied later onto the upperelectrode pattern 205 in the second recess 202 are bonded to each otherwith an adhesive layer 400 in a state in which a liquid crystal 300 isinterposed between the lower substrate 100 and the upper substrate 200.FIG. 39 is an enlarged perspective view in which the bonded lowersubstrate 100 and upper substrate 200 are cut at a position on the firstrecess 102. FIG. 40 is an enlarged sectional view in which the bondedlower substrate 100 and upper substrate 200 are cut at a position on thesecond recess 202.

Even when the first and second auxiliary electrode layers 104 and 204are applied later onto the first and second recesses 102 and 202, as inthe fifth embodiment, the end faces of the first auxiliary electrodelayer 104 and the lower electrode pattern 105 of the lower substrate 100are exposed on a lens end 302 of the lens 1 and the end faces of thesecond auxiliary electrode layer 204 and the upper electrode pattern 205of the upper substrate 200 are exposed on the lens end 302 because thelower and upper substrates 100 and 200 are cut along the cutting line301 as in FIG. 35. Other points are similar to those of the fifthembodiment.

In the sixth embodiment, the first auxiliary electrode layer 104 isformed on the recess of the lower electrode pattern 105 in the firstrecess 102 and the second auxiliary electrode layer 204 is formed on therecess of the upper electrode pattern 205 in the second recess 202. Thuseven when ITO ink having high wettability is used, it is possible tocorrectly pattern the first and second auxiliary electrode layers 104and 204 at predetermined positions on the lower substrate 100 and theupper substrate 200.

Further, the lower insulating pattern 106 and the upper insulatingpattern 206 may be formed over the substrates, thereby forminginsulating layers by sputtering without using a mask.

Seventh Embodiment

In the fourth embodiment, the first auxiliary electrode layer 104 isformed on the lower substrate 100 and then the lower insulating layerpattern 106 is formed thereon, and the second auxiliary electrode layer204 is formed on the upper substrate 200 and then the upper insulatinglayer pattern 206 is formed thereon. A seventh embodiment is differentonly in that a hole 106 b (see FIG. 41) is formed on a lower insulatinglayer pattern 106, a hole 206 b (see FIG. 41) is formed on an upperinsulating layer pattern 206, the lower insulating layer pattern 106 isformed before a first auxiliary electrode layer 104, and the upperinsulating layer pattern 206 is formed before a second auxiliaryelectrode layer 204.

In the seventh embodiment, the hole 106 b of the lower insulating layerpattern 106 formed on a lower electrode pattern 105 is filled withconductive ink and the lower electrode pattern 105 is partially coatedwith the conductive ink. Thus even when ITO ink having high wettabilityis used, it is possible to correctly pattern the first auxiliaryelectrode layer 104 at a predetermined position. Similarly, the hole 206b of the upper insulating layer pattern 206 formed on an upper electrodepattern 205 is filled with conductive ink and the upper electrodepattern 205 is partially coated with the conductive ink. Thus even whenITO ink having high wettability is used, it is possible to correctlypattern the second auxiliary electrode layer 204 at a predeterminedposition. Other points are similar to those of the fourth embodiment.

Eighth Embodiment

In the sixth embodiment, the first auxiliary electrode layer 104 isformed on the lower substrate 100 and then the lower insulating layerpattern 106 is formed thereon, and the second auxiliary electrode layer204 is formed on the upper substrate 200 and then the upper insulatinglayer pattern 206 is formed thereon. An eighth embodiment is differentonly in that a hole 106 b (see FIG. 42) is formed on a lower insulatinglayer pattern 106, a hole 206 b (see FIG. 42) is formed on an upperinsulating layer pattern 206, the lower insulating layer pattern 106 isformed before a first auxiliary electrode layer 104, and the upperinsulating layer pattern 206 is formed before a second auxiliaryelectrode layer 204.

In the eighth embodiment, the hole 106 b of the lower insulating layerpattern 106 formed on a lower electrode pattern 105 is filled withconductive ink and the lower electrode pattern 105 is partially coatedwith the conductive ink. Thus even when ITO ink having high wettabilityis used, it is possible to correctly pattern the first auxiliaryelectrode layer 104 at a predetermined position. Similarly, the hole 206b of the upper insulating layer pattern 206 formed on an upper electrodepattern 205 is filled with conductive ink and the upper electrodepattern 205 is partially coated with the conductive ink. Thus even whenITO ink having high wettability is used, it is possible to correctlypattern the second auxiliary electrode layer 204 at a predeterminedposition. Other points are similar to those of the sixth embodiment.

In the fifth, sixth, and eighth embodiments, the first and secondrecesses 102 and 202 make it possible to correctly pattern highlywettable ink at the predetermined positions and prevent the ITO ink,which is conductive ink, from spreading to the bonded surfaces of theupper and lower substrates.

In the case where patterning is performed directly on the surfaces ofthe lower substrate 100 and the upper substrate 200 without providingthe first and second recesses 102 and 202 as in the third, fourth, andseventh embodiments, a gap is formed between the bonded upper and lowersubstrates because of the thickness of the ITO ink that is conductiveink, thereby deforming the lens 1. The fifth, sixth, and eighthembodiments make it possible to satisfactorily fabricate the lens 1 withless deformation.

In the fifth, sixth, and eighth embodiments, when the first and secondrecesses 102 and 202 are composed of flat surfaces in cross section, inktends to gather at straight lines where the surfaces of the recessintersect with each other, so that the ink has a larger thickness insome portions than on the flat surfaces. In the portions where a liquidtends to gather, cracks are likely to occur owing to different drystates on the surface of an ITO ink film that is a conductive ink film,thereby increasing the resistance of a transparent conductive filmformed of ITO ink. In order to solve this problem, the first and secondrecesses 102 and 202 of the fifth, sixth, and eighth embodiments arecurved in cross section. When the first and second recesses 102 and 202are not curved in cross section but are formed by joining flat surfacesin cross section, substantially the same effect can be expected byrounding the intersections of the flat surfaces.

In the third to eighth embodiments, the transparent first and secondauxiliary electrode layers 104 and 204 are formed by applying ITO inkthat is conductive ink and the transparent lower electrode pattern 105and upper electrode pattern 205 are formed by sputtering. The lowerelectrode pattern 105 and the upper electrode pattern 205 can besimilarly formed by vacuum deposition methods other than sputtering. Theother vacuum deposition methods include CVD methods such as resistanceheating vacuum deposition, electron beam vacuum deposition, molecularbeam epitaxy, ion plating, PVD (Physical Vapor Deposition) such as ionbeam deposition, thermal CVD (thermal Chemical Vapor Deposition), plasmaCVD (plasma-enhanced chemical vapor deposition), optical CVD, epitaxialCVD, and atomic layer CVD.

Further, the transparent first and second auxiliary electrode layers 104and 204, the lower electrode pattern 105, and the upper electrodepattern 205 are made of ITO (indium tin oxide) in the example of theforegoing explanation. The layers and patterns may be made of ITOsubstitute transparent electrode materials that include niobium-dopedtitanium dioxide (Ti_(1-x)Nb_(x)O₂: TNO) not containing indium butcontaining titanium as a major component, and ZnO.

In the third to eighth embodiments, the lower insulating layer pattern106 and the upper insulating layer pattern 206 are provided. When thelower electrode pattern 105 and the upper electrode pattern 205 can beelectrically insulated in a continuous manner by the adhesive layer 400alone, at least one of the lower insulating layer pattern 106 and theupper insulating layer pattern 206 may be omitted.

INDUSTRIAL APPLICABILITY

Electronic spectacles according to the present invention ensureconnection to an electric circuit and achieve higher reliability. Thusthe present invention is useful for spectacles and sunglasses that useelectric elements such as a liquid crystal element and an electrochromicelement.

1-20. (canceled)
 21. Electronic spectacles in which a lens comprising anelectric element is set in a spectacle frame, the lens having lenselectrode pads exposed on a lens end, the lens electrode pads applying avoltage to the electric element, an electric connector having one endconnected to a control unit for controlling the electric element and another end placed in a spot facing formed at the inside of a rim of thespectacle frame, the rim being opposed to the lens electrode pads. 22.The electronic spectacles according to claim 21, wherein wiringelectrode pads are set on the other end of the electric connector placedin the spot facing at the inside of the rim, the wiring electrode padsbeing contacted with the lens electrode pads.
 23. The electronicspectacles according to claim 21, wherein a rubber member is interposedbetween the lens electrode pads and the spot facing at the inside of therim.
 24. The electronic spectacles according to claim 23, wherein therubber member is an anisotropic conductive rubber.
 25. Electronicspectacles in which a lens comprising an electric element is set in aspectacle frame, the lens having lens electrode pads for applying avoltage to the electric element in a lens-side spot facing provided at alens end.
 26. The electronic spectacles according to claim 25, wherein arubber member is exposed to the outside of the lens-side spot facingprovided at the lens end, the rubber member being contacted with thelens electrode pads.
 27. The electronic spectacles according to claim26, wherein the rubber member is an anisotropic conductive rubber.